仿真
直流压降
将每个铜层求解为电阻片:压降、电流密度、负载电压和最繁忙的过孔。
将每一层的铜皮作为电阻片求解(过孔作为电镀孔壁),电源焊盘保持其电压,负载抽取电流,使用 f64 稀疏 Cholesky 分解。器件通过 [[links]] 承载直流:电阻器取其阻值,电感和磁珠(FB)默认为 0.1 欧姆,其他器件除非链接否则视为开路。链接默认连接焊盘 1 和 2,除非 a 和 b 指定其他焊盘,因此负载开关为 { ref = "U5", resistance = "80mohm", a = "1", b = "6" }。
name = "lna-dc"
kind = "dc"
layout = "lna"
cell = 0.05 # raster cell in mm
[[supplies]]
pad = "D2.1"
voltage = "4.7V"
[[supplies]]
pad = "J3.2"
voltage = "0V"
[[loads]]
pad = "U1.3"
current = "90mA"
return = "U1.2" # where the load current comes back
[[links]]
ref = "L2"
resistance = "1.4ohm" # inductor DCR from its datasheet地图:从每个铜岛电源端测得的压降(mV)、电流密度(A/mm2)、电压。读数:电源电流、负载电压、峰值密度及其位置、负载最重的过孔。